Parameters | |
---|---|
Contact Material | Copper |
Mount | Through Hole |
Mounting Type | Through Hole |
Housing Material | Thermoplastic, Glass Filled |
Number of Positions or Pins (Grid) | 28 (2 x 14) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Beryllium Copper |
Operating Temperature | -55°C~105°C |
Packaging | Tube |
Published | 1997 |
Series | Diplomate DL |
Feature | Open Frame |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
Type | DIP, 0.6 (15.24mm) Row Spacing |
Number of Positions | 28 |
Color | Black |
Number of Rows | 2 |
Contact Finish - Mating | Tin |
Orientation | Straight |
Pitch - Mating | 0.100 2.54mm |
Body Length or Diameter | 1.395 inch |
Number of Contacts | 28 |
PCB Contact Pattern | RECTANGULAR |
Body Breadth | 0.694 inch |
Contact Style | BELLOWED TYPE |
Contact Resistance | 30mOhm |
Insulation Resistance | 10GOhm |
Mating Contact Pitch | 0.1 inch |
ELV | Compliant |
Dielectric Withstanding Voltage | 1000VAC V |
PCB Contact Row Spacing | 0.6 mm |
Termination Post Length | 0.110 2.78mm |
Pitch - Post | 0.100 2.54mm |
Material Flammability Rating | UL94 V-0 |
RoHS Status | RoHS Compliant |
Flammability Rating | UL94 V-0 |
Lead Free | Lead Free |