Parameters | |
---|---|
Contact Material | Copper |
Mount | Through Hole |
Mounting Type | Through Hole |
Insulation Material | Thermoplastic |
Housing Material | Thermoplastic, Glass Filled |
Number of Positions or Pins (Grid) | 16 (1 x 16) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Beryllium Copper |
Operating Temperature | -55°C~105°C |
Packaging | Tube |
Published | 2009 |
Series | Diplomate DL |
JESD-609 Code | e3 |
Feature | Closed Frame |
Pbfree Code | yes |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Connector Type | SIP, Socket |
Type | SIP |
Color | Black |
Number of Rows | 1 |
Gender | Female |
Additional Feature | DIPLOMATE, UL 94V-0 |
HTS Code | 8536.69.40.40 |
Contact Finish - Mating | Tin |
Orientation | Straight |
Terminal Pitch | 2.54mm |
Depth | 3.91mm |
Pitch - Mating | 0.100 2.54mm |
Number of Contacts | 16 |
PCB Contact Pattern | RECTANGULAR |
Contact Style | DUAL PRONG |
Contact Resistance | 20mOhm |
Insulation Resistance | 5GOhm |
ELV | Compliant |
Termination Post Length | 0.130 3.30mm |
Pitch - Post | 0.100 2.54mm |
Length | 40.51mm |
Material Flammability Rating | UL94 V-0 |
Radiation Hardening | No |
REACH SVHC | Unknown |
RoHS Status | RoHS Compliant |
Flammability Rating | UL94 V-0 |
Lead Free | Lead Free |