Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
ACTIVE (Last Updated: 4 months ago) |
Contact Material |
Copper Alloy |
Contact Plating |
Gold, Tin |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Housing Material |
Polyester |
Material - Insulation |
Polyester, Glass Filled |
Underplate Material |
Nickel |
Operating Temperature |
-55°C~ 85°C |
Packaging |
Bulk |
Published |
2001 |
Series |
Standard Edge II |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Termination |
Solder |
Connector Type |
Socket |
Number of Positions |
62 (61 Loaded) |
Color |
Black |
Number of Rows |
2 |
Gender |
Female |
Voltage - Rated |
400V |
Additional Feature |
POLARIZED |
MIL Conformance |
NO |
DIN Conformance |
NO |
IEC Conformance |
NO |
Filter Feature |
NO |
Mixed Contacts |
NO |
Option |
GENERAL PURPOSE |
Pitch |
0.100 2.54mm |
Orientation |
Vertical |
Contact Finish |
Gold |
Number of Contacts |
62 |
Operating Supply Voltage |
400V |
Card Type |
Non Specified - Dual Edge |
Read Out |
Dual |
Row Spacing |
4.85 mm |
ELV |
Compliant |
Max Current Rating |
4.26A |
Contact Current Rating |
4.26A |
Circuit Application |
Power |
Height |
19.812mm |
Contact Finish Thickness |
15.0μin 0.38μm |
Plating Thickness |
380 nm |
Card Thickness |
0.054 ~ 0.070 1.37mm ~ 1.78mm |
RoHS Status |
RoHS Compliant |
Flammability Rating |
UL94 V-0 |
Lead Free |
Lead Free |
6489162-1 Overview
The material was packaged according to the specifications of Bulk.Type Through Hole is recommended.Connecting the device to the connector socket Socket is the method used by the device.Standard Edge II means it's a series device.These chips have the following additional features: POLARIZED
6489162-1 Features
Standard Edge II series
6489162-1 Applications
There are a lot of TE Connectivity AMP Connectors 6489162-1 Edgeboard Connectors applications.
- Multiplexed Data Acquisition Systems
- Broadband data applications
- Transducer
- Cell Phones
- Rotary encoder
- 3-phase power control
- AC motor control
- Micro and pico cell systems, software radios
- RADAR processing, digital oscilloscopes
- Battery Operated Systems