655-53AB
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Adhesive |
| Package / Case | BGA |
| Material | Aluminum |
| Shape | Square, Pin Fins |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Material Finish | Black Anodized |
| Published | 2008 |
| Series | 655 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | Top Mount |
| Color | Black |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Height Off Base (Height of Fin) | 0.522 13.27mm |
| Thermal Resistance @ Forced Air Flow | 2.00°C/W @ 400 LFM |
| Natural Thermal Resistance | 2 °C/W |
| Profile | PIN FIN ARRAY |
| Power Dissipation @ Temperature Rise | 4.0W @ 40°C |
| Fin Orientation | OMNIDIRECT |
| Height | 13.3mm |
| Length | 1.600 40.64mm |
| Width | 1.600 40.64mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
See Relate Datesheet
