6651290-1
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | ACTIVE (Last Updated: 6 days ago) |
| Contact Material | Copper Alloy |
| Contact Plating | Gold, Tin |
| Mount | Standard, Through Hole |
| Mounting Type | Through Hole |
| Number of Pins | 12 |
| Housing Material | Thermoplastic |
| Material - Insulation | Thermoplastic, Glass Filled |
| Packaging | Bulk |
| Published | 2004 |
| Series | Crown Edge, Elcon |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Press-Fit |
| ECCN Code | EAR99 |
| Connector Type | Socket |
| Number of Positions | 12 (8 + 4 Power) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Pitch | 2.5mm |
| Orientation | Vertical |
| Contact Finish | Gold |
| Operating Supply Voltage | 250V |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Number of Positions/Bay/Row | 1; 1; 4 |
| ELV | Compliant |
| Max Current Rating | 3A |
| Contact Current Rating | 35A |
| Circuit Application | Power |
| Number of Power Positions | 4 |
| Number of Signal Positions | 8 |
| Height | 15mm |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Plating Thickness | 760 nm |
| Card Thickness | 0.062 1.57mm |
| PCB Thickness | 2.3622mm |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
6651290-1 Overview
It was packaged based on Bulk's specs.It is recommended that you mount the device with mounting type Through Hole.This device is connected via the connector socket Socket.It is indicated by Crown Edge, Elcon that the device is a series device.Keeping the temperature below 85°C°C will make it stable.Ensure that it works at a minimum temperature of -55°C degrees Celsius to ensure its reliability.The device requires 12 pins.
6651290-1 Features
Crown Edge, Elcon series
6651290-1 Applications
There are a lot of TE Connectivity AMP Connectors 6651290-1 Edgeboard Connectors applications.
- RADAR processing, digital oscilloscopes
- Digital beam-forming systems for ultrasound
- TD-SCDMA, WiMAX
- Transducer
- Communications
- Handheld Terminal Interface
- Battery Operated Systems
- Communication test equipment
- Multiplexed Data Acquisition Systems
- Broadband data applications
