66AK2H05DAAW2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 1517-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TC |
| Packaging | Tray |
| Series | 66AK2Hx KeyStone Multicore |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Type | DSP+ARM® |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Base Part Number | 66AK2H05 |
| JESD-30 Code | R-PBGA-B1517 |
| Supply Voltage-Max (Vsup) | 1.05V |
| Supply Voltage-Min (Vsup) | 0.95V |
| Interface | EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0 |
| Voltage - I/O | 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V |
| Non-Volatile Memory | ROM (384kB) |
| Voltage - Core | Variable |
| On Chip Data RAM | 8.375MB |
| Clock Rate | 1.2GHz DSP, 1.4GHz ARM® |
| Height Seated (Max) | 3.62mm |
| Length | 40mm |
| Width | 40mm |
| RoHS Status | ROHS3 Compliant |
66AK2H05DAAW2 Overview
Basically, it is a type of electronic component that is available in a 1517-BBGA, FCBGA package.There is a packaging method of Tray provided with it.Its DSP+ARM? status makes it ideal for a wide range of applications.The machine is mounted in the way of Surface Mount in order to facilitate its operation.By operating the device at the temperature of 0°C~85°C TC, a normal operation is ensured.It refers to the analog voltage range of 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V that may be input or output.This digital signal processor is part of the 66AK2Hx KeyStone Multicore series.A voltage of 1V is used as the supply voltage.It is possible to identify numerous related parts using the base part number 66AK2H05.
66AK2H05DAAW2 Features
Supplied in the 1517-BBGA, FCBGA package
66AK2H05DAAW2 Applications
There are a lot of Texas Instruments 66AK2H05DAAW2 DSP applications.
- Computers and laptop
- Sound navigation and ranging systems
- Other sensor array processing
- Instrument modeling
- Scene analysis technology
- Seismology
- Compression of videos
- Tomography technology
- Financial signals
- Medical imaging
