67SLG030030050PI00
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
| Shape | Rectangle |
| Operating Temperature | -40°C~70°C |
| Packaging | Tape & Reel (TR) |
| Published | 2015 |
| Series | SMD Grounding Metallized |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | Film Over Foam |
| Max Operating Temperature | 158°C |
| Min Operating Temperature | -40°C |
| Attachment Method | Solder |
| Height | 0.118 3.00mm |
| Length | 0.197 5.00mm |
| Width | 0.118 3.00mm |
| Thickness | 3.048mm |
| RoHS Status | RoHS Compliant |
67SLG030030050PI00 Overview
There are materials in the Contact RFI package from Polyurethane Foam, Tin-Copper Polyester (SN/CU).EMI/RFI is capable of working normally at -40°C~70°C.High reliability is achieved using advanced RFI and EMI contact' packaging Tape & Reel (TR).Contacter RFI should run at a temperature 158°C higher than 158°C.RF type is Film Over Foam from the contacter RFI.A RFI EMI from the well-known SMD Grounding Metallized series of products is being offered here.
67SLG030030050PI00 Features
Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series
67SLG030030050PI00 Applications
There are a lot of Laird Technologies EMI 67SLG030030050PI00 RFI and EMI Contacts applications.
- Health care
- Secure Payment
- Home and Security
- LED Lighting
- Low Noise Amplifier
- Power Amplifier
- Internet of Things
- Smart Meters
- Thermostats
- Smart Energy
