67SLG050060050PI00
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
| Shape | Rectangle |
| Operating Temperature | -40°C~70°C |
| Packaging | Tape & Reel (TR) |
| Published | 2015 |
| Series | SMD Grounding Metallized |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | Film Over Foam |
| Max Operating Temperature | 158°C |
| Min Operating Temperature | -40°C |
| Attachment Method | Solder |
| Height | 0.236 6.00mm |
| Length | 0.197 5.00mm |
| Width | 0.197 5.00mm |
| Thickness | 5.9944mm |
| RoHS Status | RoHS Compliant |
67SLG050060050PI00 Overview
Contact RFI is packaged with the materials of Polyurethane Foam, Tin-Copper Polyester (SN/CU).-40°C~70°C is the operating temperature for the EMI/RFI.High reliability is achieved with advanced RFI and EMI contact' packaging Tape & Reel (TR).Running the contacter RFI at 158°C is ideal.Film Over Foam RF Type from the contacter RFI.The RFI EMI is a kind of the well-known SMD Grounding Metallized series of products.
67SLG050060050PI00 Features
Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series
67SLG050060050PI00 Applications
There are a lot of Laird Technologies EMI 67SLG050060050PI00 RFI and EMI Contacts applications.
- Switch
- Industrial Logger
- Receive
- Fitness
- Home and Security
- Utility Energy
- Power management
- LoT applications
- Transmit
