67SLG060080070PI00
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
| Shape | Rectangle |
| Operating Temperature | -40°C~70°C |
| Packaging | Tape & Reel (TR) |
| Published | 2015 |
| Series | SMD Grounding Metallized |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | Film Over Foam |
| Max Operating Temperature | 158°C |
| Min Operating Temperature | -40°C |
| Attachment Method | Solder |
| Height | 0.315 8.00mm |
| Length | 0.276 7.00mm |
| Width | 0.236 6.00mm |
| Thickness | 8.001mm |
| RoHS Status | RoHS Compliant |
67SLG060080070PI00 Overview
Materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU) are used in Contact RFI packaging.EMI/RFI is able to work normally at the operating temperature of -40°C~70°C.The RFI and EMI contact' packaging Tape & Reel (TR) provides high reliability.There should be 158°C more than 158°C degrees Celsius in the contacter RFI.Film Over Foam contacter RFI type.It is one of the well-known SMD Grounding Metallized series RFI EMI line.
67SLG060080070PI00 Features
Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series
67SLG060080070PI00 Applications
There are a lot of Laird Technologies EMI 67SLG060080070PI00 RFI and EMI Contacts applications.
- Health and Fitness
- Smart Energy
- Health care
- Home and Security
- Power Amplifier
- Switch
- LoT applications
- Smart Meters
- Medical
- Power management
