67SLG100150100PI00
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
| Shape | Rectangle |
| Operating Temperature | -40°C~70°C |
| Packaging | Tape & Reel (TR) |
| Published | 2015 |
| Series | SMD Grounding Metallized |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | Film Over Foam |
| Max Operating Temperature | 158°C |
| Min Operating Temperature | -40°C |
| Attachment Method | Solder |
| Height | 0.591 15.00mm |
| Length | 0.394 10.00mm |
| Width | 0.394 10.00mm |
| Thickness | 15.0114mm |
| RoHS Status | RoHS Compliant |
67SLG100150100PI00 Overview
Materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU) are included in the Contact RFI.The EMI/RFI is capable of operating at the operating temperature of -40°C~70°C.Using advanced packaging techniques Tape & Reel (TR), high reliability is ensured.At a temperature around 158°C degrees Celsius, contacter RFI should be running.Film Over Foam Type from the contacter RFI.The RFI EMI that you are looking at comes from our well-known SMD Grounding Metallized series product line.
67SLG100150100PI00 Features
Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series
67SLG100150100PI00 Applications
There are a lot of Laird Technologies EMI 67SLG100150100PI00 RFI and EMI Contacts applications.
- Fitness
- Smart Meters
- Health and Fitness
- Receive
- Internet of Things
- Switch
- Smart Energy
- Industrial Logger
- Transmit
- Health care
