Parameters | |
---|---|
Factory Lead Time | 1 Week |
Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
Shape | Hourglass |
Operating Temperature | -40°C~70°C |
Packaging | Tape & Reel (TR) |
Published | 2015 |
Series | SMD Grounding Metallized |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Type | Film Over Foam |
Max Operating Temperature | 158°C |
Min Operating Temperature | -40°C |
Attachment Method | Solder |
Height | 0.197 5.00mm |
Length | 0.118 3.00mm |
Width | 0.197 5.00mm |
Thickness | 5.0038mm |
RoHS Status | RoHS Compliant |