Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Package / Case | TO-263 |
Material | Copper |
Shape | Rectangular, Fins |
Package Cooled | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 |
Material Finish | Tin |
Packaging | Box |
Published | 2007 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Type | Top Mount |
Depth | 14.99mm |
Attachment Method | SMD Pad |
Height Off Base (Height of Fin) | 0.375 9.52mm |
Thermal Resistance @ Forced Air Flow | 5.00°C/W @ 400 LFM |
Natural Thermal Resistance | 15 °C/W |
Power Dissipation @ Temperature Rise | 2.0W @ 40°C |
Height | 10mm |
Length | 0.590 15.00mm |
Width | 1.020 25.91mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |