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7106DG

BOARD LEVEL HEATSINK .375" D2PAK


  • Manufacturer: Aavid, Thermal Division of Boyd Corporation
  • Nocochips NO: 4-7106DG
  • Package: TO-263
  • Datasheet: PDF
  • Stock: 966
  • Description: BOARD LEVEL HEATSINK .375" D2PAK (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Plating Tin
Mount Surface Mount
Package / Case TO-263
Material Copper
Shape Rectangular, Fins
Package Cooled TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10
Material Finish Tin
Packaging Box
Published 2007
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Top Mount
Depth 14.99mm
Attachment Method SMD Pad
Height Off Base (Height of Fin) 0.375 9.52mm
Thermal Resistance @ Forced Air Flow 5.00°C/W @ 400 LFM
Natural Thermal Resistance 15 °C/W
Power Dissipation @ Temperature Rise 2.0W @ 40°C
Height 10mm
Length 0.590 15.00mm
Width 1.020 25.91mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status RoHS Compliant
Lead Free Lead Free
See Relate Datesheet

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