7200L20TDB
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Through Hole |
| Package / Case | 28-CDIP (0.300, 7.62mm) |
| Operating Temperature | -55°C~125°C |
| Packaging | Tube |
| Series | 7200 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Voltage - Supply | 4.5V~5.5V |
| Function | Asynchronous |
| Current - Supply (Max) | 100mA Typ |
| Memory Size | 2.25K 256 x 9 |
| Access Time | 20ns |
| Data Rate | 33.3MHz |
| Bus Directional | Uni-Directional |
| Retransmit Capability | Yes |
| Programmable Flags Support | No |
| Expansion Type | Depth, Width |
| RoHS Status | Non-RoHS Compliant |
7200L20TDB Overview
28-CDIP (0.300, 7.62mm) is the package in which FIFO memory chip is contained.It comes in a Tube package.There is a 2.25K 256 x 9 MB memory on the FIFO chips, which can be used to store both applications and data.It is recommended that the temperature be kept at -55°C~125°C to ensure reliable operation.Mounting type Through Hole is assigned to the FIFO memory.A supply voltage of 4.5V~5.5V is required for its operation.The memory logic belongs to the series 7200 .Memory IC's maximum operating supply current is 100mA Typ .
7200L20TDB Features
2.25K 256 x 9 memory size
7200 series
7200L20TDB Applications
There are a lot of Renesas Electronics America Inc. 7200L20TDB FIFOs Memory applications.
- Data communications
- Seismic Data Collection at Extreme Temperatures
- Laser Receiver System
- Tape controllers
- Optical memories
- Test site
- Extended product life cycle
- Thermal Management for DDR3 Memory Modules
- Telecommunication
- Battery Charger
