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72201L25PF

5V 32 Pin FIFO memory IC15 ns Min 4.5V VMax 5.5V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Nocochips NO: 378-72201L25PF
  • Package: TQFP
  • Datasheet: PDF
  • Stock: 975
  • Description: 5V 32 Pin FIFO memory IC15 ns Min 4.5V VMax 5.5V V(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case TQFP
Number of Pins 32
Published 2005
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 40MHz
Operating Supply Voltage 5V
Max Supply Voltage 5.5V
Min Supply Voltage 4.5V
Element Configuration Dual
Nominal Supply Current 35mA
Max Supply Current 35mA
Frequency (Max) 40MHz
Access Time 15 ns
Direction Unidirectional
Density 2.3 kb
Sync/Async Synchronous
Word Size 9b
Bus Directional Unidirectional
Retransmit Capability No
FWFT Support No
Programmable Flags Support Yes
Length 7mm
Width 7mm
Thickness 1.4mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

72201L25PF Overview


The TQFP package contains FIFO memory chip.Surface Mount is recommended as the mounting method.32 pin is used for operation.In order for FIFO design to operate, FIFO design requires a maximum current of 35mA .When the supply voltage is set to 5V , the FIFO's maximum efficiency is achieved.For reliability, FIFO works at a minimum temperature of 0°C degrees Celsius.As a result of having a maximum operating temperature of 70°C degrees Celsius, the unit is capable of exhibiting stable operation.Typically, FIFO would work at 4.5V volts, but it may also work at higher voltages.A maximum supply voltage of 5.5V V can be handled by this FIFO memory chip.It maintains good accuracy at a 40MHz frequency.Normally, the FIFO memory's maximum value is 40MHz .

72201L25PF Features


Frequency at most

72201L25PF Applications


There are a lot of Integrated Device Technology (IDT) 72201L25PF FIFOs Memory applications.

  • Rate buffers
  • Test Equipment
  • Network switching/routing
  • Product traceability
  • Computer networks
  • Signal processing
  • Measurement Equipment
  • Thermal Management for DDR3 Memory Modules
  • Temporary storage elements
  • Notebook

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