72225LB10J8
| Parameters | |
|---|---|
| Contact Plating | Lead, Tin |
| Mount | Surface Mount |
| Package / Case | PLCC |
| Number of Pins | 68 |
| Published | 2000 |
| Part Status | Active |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Frequency | 100MHz |
| Operating Supply Voltage | 5V |
| Max Supply Voltage | 5.5V |
| Min Supply Voltage | 4.5V |
| Element Configuration | Dual |
| Nominal Supply Current | 60mA |
| Max Supply Current | 60mA |
| Frequency (Max) | 100MHz |
| Access Time | 6.5 ns |
| Direction | Unidirectional |
| Density | 18 kb |
| Sync/Async | Synchronous |
| Word Size | 18b |
| Bus Directional | Unidirectional |
| Retransmit Capability | No |
| FWFT Support | No |
| Programmable Flags Support | Yes |
| Length | 24mm |
| Width | 24mm |
| Thickness | 3.63mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Contains Lead |
| Factory Lead Time | 1 Week |
72225LB10J8 Overview
This package is included in PLCC .It is recommended that memory IC be mounted in the Surface Mount direction.68 pins are used for operation.For its operation, 60mA is the maximum current required.In order to maximize efficiency, the supply voltage should be set to 5V .FIFO operates at a minimum temperature of 0°C degrees Celsius to ensure reliabilFIFOy.By using a memory logic's maximum operating temperature of 70°C degrees Celsius, stable operation can be achieved.FIFO may operate at very low supply voltages, such as 4.5V volts.FIFO memory can handle a maximum supply voltage of 5.5V V.It is capable of maintaining good accuracy with a frequency of 100MHz .During regular operation, 100MHz is the FIFO memory's maximum value.
72225LB10J8 Features
Frequency at most
72225LB10J8 Applications
There are a lot of Integrated Device Technology (IDT) 72225LB10J8 FIFOs Memory applications.
- Address mapping
- MP3 Interface for Automobile
- SPI Bus Flash Memory Device
- Controlled baseline
- Signal processing
- Network bridges
- SPI Bus Flash Memory Devices
- Thermal Management for DDR3 Memory Modules
- General Data Collection Applications at Extreme High-Temperatures
- Temporary storage elements
