Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
64-LQFP |
Supplier Device Package |
64-TQFP (10x10) |
Operating Temperature |
0°C~70°C |
Packaging |
Tray |
Series |
7200 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Voltage - Supply |
4V~5.5V |
Base Part Number |
72265 |
Function |
Synchronous |
Current - Supply (Max) |
80mA |
Memory Size |
288K 16K x 18 |
Access Time |
8ns |
Data Rate |
100MHz |
Bus Directional |
Uni-Directional |
Retransmit Capability |
Yes |
FWFT Support |
Yes |
Programmable Flags Support |
Yes |
Expansion Type |
Depth, Width |
RoHS Status |
ROHS3 Compliant |
72265LA10TFG Overview
You can find FIFO memory chip in the 64-LQFP package.In this case, it is packaged in case number Tray .Data and applications can be stored in the FIFO chip's 288K 16K x 18 memory.To ensure reliable operation, the temperature should be regulated to 0°C~70°C .It is mounted in the Surface Mount position.Powered by a voltage of 4V~5.5V , it operates on a low supply voltage.This memory logic is part of the 7200 series.It has a maximum operating supply current of 80mA .Memory IC is a member of the 72265 family.
72265LA10TFG Features
288K 16K x 18 memory size
7200 series
Best part number of 72265
72265LA10TFG Applications
There are a lot of Renesas Electronics America Inc. 72265LA10TFG FIFOs Memory applications.
- Optical memories
- Disk Controllers
- SPI Bus Flash Memory Device
- Data communications
- Product traceability
- Notebook
- Smart Meter
- General Data Collection Applications at Extreme High-Temperatures
- Alarm System
- Thermal Management for DDR3 Memory Modules