Parameters |
Word Size |
36b |
Bus Directional |
Bidirectional |
Retransmit Capability |
Yes |
FWFT Support |
Yes |
Programmable Flags Support |
Yes |
Length |
14mm |
Width |
14mm |
Thickness |
1.4mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
Factory Lead Time |
1 Week |
Contact Plating |
Tin |
Mount |
Surface Mount |
Package / Case |
TQFP |
Number of Pins |
120 |
Packaging |
Tape & Reel |
Published |
2009 |
Part Status |
Active |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
Frequency |
66.7MHz |
Operating Supply Voltage |
5V |
Max Supply Voltage |
5.5V |
Min Supply Voltage |
4.5V |
Element Configuration |
Dual |
Nominal Supply Current |
400μA |
Max Supply Current |
400μA |
Frequency (Max) |
66.7MHz |
Access Time |
11 ns |
Direction |
Bidirectional |
Density |
36 kb |
Sync/Async |
Synchronous |
723641L15PFG8 Overview
TQFP is a package that contains FIFO memory chip.In the shape of a Tape & Reel , it's packaged.Surface Mount is memory IC's recommended mounting method.FIFO design has 120 operation pins.There is a maximum current requirement of 400μA for its operation.A supply voltage of 5V is recommended for FIFO's maximum efficiency.At a minimum working temperature of 0°C degrees Celsius, FIFO is guaranteed to operate reliably.By using a memory logic's maximum operating temperature of 70°C degrees Celsius, stable operation can be achieved.If the supply voltage is very low, such as 4.5V V, FIFO may be able to operate.FIFO memory can handle a maximum supply voltage of 5.5V V.It is capable of maintaining good accuracy with a frequency of 66.7MHz .During regular operation, the FIFO memory's maximum value is 66.7MHz .
723641L15PFG8 Features
Frequency at most
723641L15PFG8 Applications
There are a lot of Integrated Device Technology (IDT) 723641L15PFG8 FIFOs Memory applications.
- Multimedia
- General Data Collection Applications at Extreme High-Temperatures
- Networking
- Firmware loaders
- Network switching/routing
- High-speed disk
- Tape controllers
- General Data Collection Applications at Low-Temperatures
- Portable Information Devices
- Data communications