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723663L15PF

5V 128 Pin FIFO memory IC10 ns Min 4.5V VMax 5.5V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Nocochips NO: 378-723663L15PF
  • Package: TQFP
  • Datasheet: PDF
  • Stock: 907
  • Description: 5V 128 Pin FIFO memory IC10 ns Min 4.5V VMax 5.5V V(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case TQFP
Number of Pins 128
Published 2005
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 66.7MHz
Operating Supply Voltage 5V
Max Supply Voltage 5.5V
Min Supply Voltage 4.5V
Element Configuration Dual
Nominal Supply Current 400mA
Max Supply Current 400mA
Frequency (Max) 66.7MHz
Access Time 10 ns
Direction Bidirectional
Density 144 kb
Sync/Async Synchronous
Word Size 36b
Bus Directional Bidirectional
Retransmit Capability Yes
FWFT Support Yes
Programmable Flags Support Yes
Length 20mm
Width 14mm
Thickness 1.4mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

723663L15PF Overview


FIFO memory chip can be found in the TQFP package.The recommended mounting way is Surface Mount .128 pins are used for operation.In order for FIFO design to operate, FIFO design requires a maximum current of 400mA .In order to maximize efficiency, the supply voltage should be set to 5V .Keeping the temperature at 0°C degrees Celsius ensures its reliability.A memory logic's maximum operating temperature of 70°C degrees Celsius assures stable operation.Typically, FIFO would work at 4.5V volts, but it may also work at higher voltages.A maximum supply voltage of 5.5V volts can be handled by the FIFO memory chip.In the presence of a 66.7MHz frequency, it can maintain good accuracy.During normal operation, the FIFO memory's maximum value is 66.7MHz .

723663L15PF Features


Frequency at most

723663L15PF Applications


There are a lot of Integrated Device Technology (IDT) 723663L15PF FIFOs Memory applications.

  • Extended product-change notification
  • Communications
  • Network switching/routing
  • Video Processing
  • Thermal Management for DDR3 Memory Modules
  • Wireless
  • TVs
  • One assembly
  • Analog-to-digital converters
  • Emulators

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