7282L15PA
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Lead, Tin |
| Mount | Surface Mount |
| Package / Case | TSSOP |
| Number of Pins | 56 |
| Published | 2005 |
| Part Status | Active |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Operating Supply Voltage | 5V |
| Number of Circuits | 2 |
| Max Supply Voltage | 5.5V |
| Min Supply Voltage | 4.5V |
| Memory Size | 1.1kB |
| Element Configuration | Dual |
| Nominal Supply Current | 125mA |
| Max Supply Current | 125mA |
| Frequency (Max) | 40MHz |
| Access Time | 15 ns |
| Data Bus Width | 9b |
| Direction | Bidirectional |
| Density | 9 kb |
| Sync/Async | Asynchronous |
| Word Size | 9b |
| Bus Directional | Unidirectional |
| Retransmit Capability | Yes |
| FWFT Support | No |
| Programmable Flags Support | No |
| Length | 14mm |
| Width | 6.1mm |
| Thickness | 1mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Contains Lead |
7282L15PA Overview
You will find FIFO memory chip in the TSSOP package.In addition to storing applications and data, the FIFO chips have a memory of 1.1kB .The recommended mounting way is Surface Mount .These are the 56 pins for operation.In order for FIFO design to operate, a maximum current of 125mA is required.FIFO is recommended that the supply voltage be set to 5V in order to maximize efficiency.To ensure reliabilFIFOy, FIFO runs at a minimum working temperature of 0°C degrees Celsius.Its maximum operating temperature of 70°C °C ensures stable operation.FIFO may operate at very low supply voltages, such as 4.5V volts.A maximum supply voltage of 5.5V V can be handled by this FIFO memory chip.There is 40MHz FIFO memory IC's maximum value for regular operation.Due to the use of 2 circuits, FIFO memory chip has an enhanced level of flexibility.
7282L15PA Features
1.1kB memory size
Frequency at most
7282L15PA Applications
There are a lot of Integrated Device Technology (IDT) 7282L15PA FIFOs Memory applications.
- Notebook
- Magnetic memories
- General Data Collection Applications at Low-Temperatures
- IP Camera Buffer
- Thermal Management for DDR3 Memory Modules
- Video Processing
- Game Controller
- Portable Information Devices
- Battery Charger
- High-speed disk
