72T18125L4-4BB
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Lead, Tin |
| Mount | Surface Mount |
| Package / Case | BGA |
| Number of Pins | 240 |
| Published | 2009 |
| Part Status | Active |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Operating Supply Voltage | 2.5V |
| Max Supply Voltage | 2.625V |
| Min Supply Voltage | 2.375V |
| Element Configuration | Dual |
| Nominal Supply Current | 70mA |
| Max Supply Current | 70mA |
| Frequency (Max) | 225MHz |
| Access Time | 3.4 ns |
| Density | 9 Mb |
| Sync/Async | Asynchronous |
| Bus Directional | Unidirectional |
| Retransmit Capability | Yes |
| Length | 19mm |
| Width | 19mm |
| Thickness | 1.76mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Contains Lead |
72T18125L4-4BB Overview
The BGA package contains FIFO memory chip.The recommended mounting method for this FIFO products is Surface Mount .240 pins are the operation pins.In order for FIFO design to operate, FIFO design requires a maximum current of 70mA .Set the supply voltage to 2.5V to ensure FIFO's maximum efficiency.Keeping the temperature at 0°C degrees Celsius ensures its reliability.The stable operation is enabled by the memory logic's maximum operating temperature of 70°C °C.In some cases, FIFO operates at a very low supply voltage, such as 2.375V V.A maximum supply voltage of 2.625V volts can be handled by the FIFO memory chip.225MHz is the FIFO memory IC's maximum value for regular operation.
72T18125L4-4BB Features
Frequency at most
72T18125L4-4BB Applications
There are a lot of Integrated Device Technology (IDT) 72T18125L4-4BB FIFOs Memory applications.
- SPI Bus Flash Memory Devices
- Analog-to-digital converters
- High-speed disk
- Buses
- Signal processing
- Fabrication Site
- PC peripheral
- Communications Systems
- Disk Controllers
- SPI Bus Flash Memory Device
