Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Lead, Tin |
Mount |
Surface Mount |
Package / Case |
BGA |
Number of Pins |
144 |
Published |
2009 |
Part Status |
Active |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
Operating Supply Voltage |
2.5V |
Max Supply Voltage |
2.625V |
Min Supply Voltage |
2.375V |
Element Configuration |
Dual |
Nominal Supply Current |
60mA |
Max Supply Current |
60mA |
Frequency (Max) |
225MHz |
Access Time |
3.4 ns |
Density |
288 kb |
Sync/Async |
Asynchronous |
Bus Directional |
Unidirectional |
Retransmit Capability |
Yes |
Length |
13mm |
Width |
13mm |
Thickness |
1.76mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Contains Lead |
72T1875L4-4BB Overview
The BGA package contains FIFO memory chip.The recommended mounting way is Surface Mount .FIFO design has 144 operation pins.There is a maximum current requirement of 60mA for its operation.In order to maximize efficiency, the supply voltage should be set to 2.5V .In order to ensure reliability, FIFO is maintained at 0°C degrees Celsius at all times.The stable operation is enabled by the memory logic's maximum operating temperature of 70°C °C.The FIFO memory chip may be operated at very low supply voltages, such as2.375V volts.This FIFO memory chip can handle maximum supply voltages of 2.625V volts.The memory logic's maximum value is 225MHz for regular operation.
72T1875L4-4BB Features
Frequency at most
72T1875L4-4BB Applications
There are a lot of Integrated Device Technology (IDT) 72T1875L4-4BB FIFOs Memory applications.
- Cardiac Monitoring Device
- Cameras
- SPD for DDR3 Memory Modules
- Multi-stage synchronizer
- Address mapping
- Transistors
- Event Recorder
- Video
- Extended product life cycle
- Disk Controllers