Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Lead, Tin |
Mount |
Surface Mount |
Package / Case |
BGA |
Number of Pins |
144 |
Packaging |
Bulk |
Published |
2009 |
Part Status |
Active |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
Operating Supply Voltage |
2.5V |
Max Supply Voltage |
2.625V |
Min Supply Voltage |
2.375V |
Element Configuration |
Dual |
Nominal Supply Current |
60mA |
Max Supply Current |
60mA |
Frequency (Max) |
225MHz |
Access Time |
3.4 ns |
Density |
1.1 Mb |
Sync/Async |
Asynchronous |
Bus Directional |
Unidirectional |
Retransmit Capability |
Yes |
Length |
13mm |
Width |
13mm |
Thickness |
1.76mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Contains Lead |
72T1895L4-4BB Overview
BGA is a package that contains FIFO memory chip.There is a case Bulk in which it is packaged.Surface Mount is memory IC's recommended mounting method.Operation pins are 144 .For its operation, 60mA is the maximum current required.FIFO is recommended that the supply voltage be set to 2.5V in order to maximize efficiency.For reliability, FIFO works at a minimum temperature of 0°C degrees Celsius.By using a memory logic's maximum operating temperature of 70°C degrees Celsius, stable operation can be achieved.FIFO memory chips may be operated at very low supply voltages, such as 2.375V volts.A maximum supply voltage of 2.625V V can be handled by this FIFO memory chip.225MHz is the FIFO memory IC's maximum value for regular operation.
72T1895L4-4BB Features
Frequency at most
72T1895L4-4BB Applications
There are a lot of Integrated Device Technology (IDT) 72T1895L4-4BB FIFOs Memory applications.
- Controlled baseline
- Test Equipment
- Desktop Computers
- Data-acquisition systems
- Communications Systems
- Character generators
- Digital buffering
- General Data Collection Applications at Low-Temperatures
- Extended product life cycle
- Network switching/routing