72T36105L10BB
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Lead, Tin |
| Mount | Surface Mount |
| Package / Case | BGA |
| Number of Pins | 240 |
| Packaging | Bulk |
| Published | 2009 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 |
| Number of Terminations | 240 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| HTS Code | 8542.32.00.71 |
| Subcategory | FIFOs |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 225 |
| Number of Functions | 1 |
| Supply Voltage | 2.5V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Pin Count | 240 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 2.5V |
| Temperature Grade | COMMERCIAL |
| Max Supply Voltage | 2.625V |
| Min Supply Voltage | 2.375V |
| Element Configuration | Dual |
| Nominal Supply Current | 90mA |
| Max Supply Current | 90mA |
| Frequency (Max) | 100MHz |
| Access Time | 4.5 ns |
| Organization | 64KX36 |
| Density | 2.3 Mb |
| Standby Current-Max | 0.01A |
| Parallel/Serial | PARALLEL |
| Sync/Async | Asynchronous |
| Word Size | 36b |
| Memory IC Type | OTHER FIFO |
| Bus Directional | Unidirectional |
| Retransmit Capability | Yes |
| Output Enable | YES |
| Cycle Time | 10 ns |
| Height Seated (Max) | 1.97mm |
| Length | 19mm |
| Width | 19mm |
| Thickness | 1.76mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Contains Lead |
72T36105L10BB Overview
BGA is a package that contains FIFO memory chip.It's packaged in the shape of a Bulk .Memory IC's recommended mounted way is Surface Mount .When the supply voltage is 2.5V , high efficiency is possible.I found that it has 240 terminations in FIFO means.240 pin is used for operation.FIFO design requires 90mA amps of current to operate.In order to maximize efficiency, the supply voltage should be set to 2.5V .During operation, a minimum temperature of 0°C degrees Celsius should be maintained in order to ensure reliability.The memory logic's maximum operating temperature is 70°C °C, which allows for stable operation.It is contained within FIFOs .There is a memory type OTHER FIFO in the IC of this part.If the supply voltage is very low, such as 2.375V V, FIFO may be able to operate.An input voltage of 2.625V V is the maximum that FIFO memory can handle.There are a total of 240 pins on this board.Normally, the FIFO memory's maximum value is 100MHz .
72T36105L10BB Features
FIFOs category
Frequency at most
72T36105L10BB Applications
There are a lot of Integrated Device Technology (IDT) 72T36105L10BB FIFOs Memory applications.
- SPI Bus Flash Memory Device
- Code converters
- High-speed disk
- Notebook
- Analog-to-digital converters
- Portable Information Devices
- Digital buffering
- Firmware loaders
- Product traceability
- Video time base correction
