Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Copper, Silver, Tin |
Mount |
Surface Mount |
Package / Case |
BGA |
Number of Pins |
240 |
Published |
2009 |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
Operating Supply Voltage |
2.5V |
Max Supply Voltage |
2.625V |
Min Supply Voltage |
2.375V |
Max Supply Current |
90mA |
Access Time |
3.4 ns |
Bus Directional |
Unidirectional |
Retransmit Capability |
Yes |
RoHS Status |
RoHS Compliant |
72T36105L4-4BBG Overview
BGA is the package in which FIFO memory chip is contained.The recommended mounting method for this FIFO products is Surface Mount .These are the 240 pins for operation.In order to operate it, it requires 90mA volts of current.Set the supply voltage to 2.5V to ensure FIFO's maximum efficiency.To ensure reliabilFIFOy, FIFO runs at a minimum working temperature of 0°C degrees Celsius.By using a memory logic's maximum operating temperature of 70°C degrees Celsius, stable operation can be achieved.It is possible to operate the FIFO memory chip at very low supply voltages, such as 2.375V volts.A maximum supply voltage of 2.625V volts can be handled by the FIFO memory chip.
72T36105L4-4BBG Features
72T36105L4-4BBG Applications
There are a lot of Integrated Device Technology (IDT) 72T36105L4-4BBG FIFOs Memory applications.
- Game Consoles
- Industrial Systems
- Consumer Systems
- Multimedia
- Thermal Management for DDR3 Memory Modules
- Emulators
- Video time base correction
- TVs
- Digital buffering
- Smart Meter