Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Lead, Tin |
Mount |
Surface Mount |
Package / Case |
BGA |
Number of Pins |
240 |
Packaging |
Bulk |
Published |
2009 |
Part Status |
Active |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
Operating Supply Voltage |
2.5V |
Max Supply Voltage |
2.625V |
Min Supply Voltage |
2.375V |
Element Configuration |
Dual |
Nominal Supply Current |
90mA |
Max Supply Current |
90mA |
Frequency (Max) |
200MHz |
Access Time |
3.6 ns |
Density |
2.3 Mb |
Sync/Async |
Asynchronous |
Word Size |
36b |
Bus Directional |
Unidirectional |
Retransmit Capability |
Yes |
Length |
19mm |
Width |
19mm |
Thickness |
1.76mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Contains Lead |
72T36105L5BB Overview
BGA is a package that contains FIFO memory chip.It's packaged in the shape of a Bulk .A Surface Mount mounting method is recommended.As far as the operation pins are concerned, they are 240 pins.There is a maximum current requirement of 90mA for its operation.Set the supply voltage to 2.5V to ensure FIFO's maximum efficiency.During operation, a minimum temperature of 0°C degrees Celsius should be maintained in order to ensure reliability.By using a memory logic's maximum operating temperature of 70°C degrees Celsius, stable operation can be achieved.If the supply voltage is very low, such as 2.375V V, FIFO may be able to operate.A maximum voltage of 2.625V volts can be applied to FIFO memory.The memory logic's maximum value is 200MHz for regular operation.
72T36105L5BB Features
Frequency at most
72T36105L5BB Applications
There are a lot of Integrated Device Technology (IDT) 72T36105L5BB FIFOs Memory applications.
- SPD for DDR3 Memory Modules
- TVs
- Video time base correction
- Buses
- Video
- Portable Information Devices
- Medical Monitoring Device
- Multi-stage synchronizer
- Rate buffers
- Data communications