72T36125L5BB
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 240-BGA |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Series | 72T |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 2.375V~2.625V |
| Base Part Number | 72T36125 |
| Function | Asynchronous, Synchronous |
| Current - Supply (Max) | 90mA |
| Memory Size | 9M 256K x 36 |
| Access Time | 10ns, 3.6ns |
| Data Rate | 83MHz, 200MHz |
| Bus Directional | Uni-Directional |
| FWFT Support | Yes |
| Expansion Type | Depth, Width |
| RoHS Status | Non-RoHS Compliant |
72T36125L5BB Overview
240-BGA is the package in which FIFO memory chip is contained.In the shape of a Tray , it's packaged.Data and applications can be stored in the FIFO chip's 9M 256K x 36 memory.It is advisable to regulate the temperature to 0°C~70°C to ensure reliable operation.Surface Mount is the mounting type of the FIFO memory.Operation is based on a supply voltage of 2.375V~2.625V .The 72T series comprises this memory logic.Memory IC's maximum operating supply current is 90mA .In terms of its family, it is part of the 72T36125 family.
72T36125L5BB Features
9M 256K x 36 memory size
72T series
Best part number of 72T36125
72T36125L5BB Applications
There are a lot of Renesas Electronics America Inc. 72T36125L5BB FIFOs Memory applications.
- SPI Bus Flash Memory Device
- Down-Hole Energy Drilling
- Queues for communication systems
- Medical Monitoring Device
- Disk Controllers
- General Data Collection Applications at Extreme High-Temperatures
- High-speed graphics pixel buffer
- Look-up Tables
- Extended product life cycle
- Application that requires re-writable nonvolatile parameter memory
