Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Copper, Silver, Tin |
Mount |
Surface Mount |
Package / Case |
BGA |
Number of Pins |
240 |
Packaging |
Bulk |
Published |
2009 |
Part Status |
Active |
Max Operating Temperature |
85°C |
Min Operating Temperature |
-40°C |
Operating Supply Voltage |
2.5V |
Max Supply Voltage |
2.625V |
Min Supply Voltage |
2.375V |
Element Configuration |
Dual |
Nominal Supply Current |
90mA |
Max Supply Current |
90mA |
Frequency (Max) |
200MHz |
Access Time |
3.6 ns |
Direction |
Unidirectional |
Density |
9 Mb |
Sync/Async |
Asynchronous |
Word Size |
36b |
Bus Directional |
Unidirectional |
Retransmit Capability |
Yes |
FWFT Support |
Yes |
Programmable Flags Support |
Yes |
Length |
19mm |
Width |
19mm |
Thickness |
1.76mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
72T36125L5BBGI Overview
BGA is a package that contains FIFO memory chip.The package comes in a case of Bulk .Mounting it Surface Mount is recommended.240 pins are used for operation.The maximum current required for its operation is 90mA .A supply voltage of 2.5V is recommended for FIFO's maximum efficiency.Keeping the temperature at -40°C degrees Celsius ensures its reliability.A memory logic's maximum operating temperature of 85°C degrees Celsius assures stable operation.Typically, FIFO would work at 2.375V volts, but it may also work at higher voltages.This FIFO memory chip can handle maximum supply voltages of 2.625V volts.During regular operation, 200MHz is the FIFO memory's maximum value.
72T36125L5BBGI Features
Frequency at most
72T36125L5BBGI Applications
There are a lot of Integrated Device Technology (IDT) 72T36125L5BBGI FIFOs Memory applications.
- Tape controllers
- Seismic Data Collection at Extreme Temperatures
- Temporary storage elements
- Test site
- Telecommunication
- Application that requires re-writable nonvolatile parameter memory
- Video
- SPI Bus Flash Memory Device
- Industrial Systems
- Disk Controllers