Parameters |
Contact Plating |
Lead, Tin |
Mount |
Surface Mount |
Package / Case |
BGA |
Number of Pins |
208 |
Weight |
830.300833mg |
Published |
2009 |
Part Status |
Discontinued |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
Operating Supply Voltage |
2.5V |
Max Supply Voltage |
2.625V |
Min Supply Voltage |
2.375V |
Element Configuration |
Dual |
Nominal Supply Current |
70mA |
Max Supply Current |
70mA |
Frequency (Max) |
150MHz |
Access Time |
3.8 ns |
Density |
144 kb |
Sync/Async |
Asynchronous |
Word Size |
36b |
Bus Directional |
Unidirectional |
Retransmit Capability |
Yes |
Length |
17mm |
Width |
17mm |
Thickness |
1.76mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Contains Lead |
72T3665L6-7BB Overview
FIFO memory chip is contained in the BGA package.The recommended mounting method for this FIFO products is Surface Mount .FIFO design has 208 operation pins.In order to operate it, it requires 70mA volts of current.FIFO is recommended that the supply voltage be set to 2.5V in order to maximize efficiency.FIFO operates at a minimum temperature of 0°C degrees Celsius to ensure reliabilFIFOy.By using a memory logic's maximum operating temperature of 70°C degrees Celsius, stable operation can be achieved.There is a possibility that FIFO can operate at very low supply voltages, such as 2.375V V.A maximum supply voltage of 2.625V volts can be handled by the FIFO memory chip.There is 150MHz FIFO memory IC's maximum value for regular operation.
72T3665L6-7BB Features
Frequency at most
72T3665L6-7BB Applications
There are a lot of Integrated Device Technology (IDT) 72T3665L6-7BB FIFOs Memory applications.
- Communications Systems
- Networking
- Computers
- Thermal Management for DDR3 Memory Modules
- Battery Charger
- Down-Hole Energy Drilling
- Digital buffering
- Character generators
- Emulators
- Cameras