Parameters |
Contact Plating |
Lead, Tin |
Mount |
Surface Mount |
Package / Case |
BGA |
Number of Pins |
208 |
Weight |
830.300833mg |
Published |
2009 |
Part Status |
Discontinued |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
Operating Supply Voltage |
2.5V |
Max Supply Voltage |
2.625V |
Min Supply Voltage |
2.375V |
Element Configuration |
Dual |
Nominal Supply Current |
70mA |
Max Supply Current |
70mA |
Frequency (Max) |
200MHz |
Access Time |
3.6 ns |
Direction |
Unidirectional |
Density |
288 kb |
Sync/Async |
Asynchronous |
Word Size |
36b |
Bus Directional |
Unidirectional |
Retransmit Capability |
Yes |
FWFT Support |
Yes |
Programmable Flags Support |
Yes |
Length |
17mm |
Width |
17mm |
Thickness |
1.76mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Contains Lead |
72T3675L5BB Overview
The BGA package contains FIFO memory chip.Surface Mount is recommended as the mounting method.There are 208 pins on the operation pins.FIFO requires a minimum of 70mA current to operate.Set the supply voltage to 2.5V to ensure FIFO's maximum efficiency.During operation, a minimum temperature of 0°C degrees Celsius should be maintained in order to ensure reliability.By operating at 70°C degrees Celsius, this FIFO products is able to maintain a stable operation.In some cases, FIFO operates at a very low supply voltage, such as 2.375V V.The FIFO memory chip is capable of handling maximum supply voltages of 2.625V volts.The memory logic's maximum value is 200MHz for regular operation.
72T3675L5BB Features
Frequency at most
72T3675L5BB Applications
There are a lot of Integrated Device Technology (IDT) 72T3675L5BB FIFOs Memory applications.
- Data
- Extended product-change notification
- Digital buffering
- Multimedia
- HDD
- One assembly
- General Data Collection Applications at Low-Temperatures
- Notebook
- Test Equipment
- Product traceability