Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Lead, Tin |
Mount |
Surface Mount |
Package / Case |
BGA |
Number of Pins |
324 |
Published |
2009 |
Part Status |
Active |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
Frequency |
225MHz |
Operating Supply Voltage |
2.5V |
Max Supply Voltage |
2.625V |
Min Supply Voltage |
2.375V |
Element Configuration |
Dual |
Nominal Supply Current |
130mA |
Max Supply Current |
130mA |
Frequency (Max) |
225MHz |
Access Time |
3.4 ns |
Density |
9 Mb |
Sync/Async |
Synchronous |
Word Size |
72b |
Bus Directional |
Unidirectional |
Retransmit Capability |
Yes |
Length |
19mm |
Width |
19mm |
Thickness |
1.76mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Contains Lead |
72T72115L4-4BB Overview
BGA is a package that contains FIFO memory chip.Mounting it Surface Mount is recommended.The operation pins are 324 pins.In order for FIFO design to operate, a maximum current of 130mA is required.FIFO is recommended that the supply voltage be set to 2.5V for maximum efficiency.It operates at 0°C degrees Celsius to ensure reliability.As a result of having a maximum operating temperature of 70°C degrees Celsius, the unit is capable of exhibiting stable operation.It is possible to operate the FIFO memory chip at very low supply voltages, such as 2.375V volts.An input voltage of 2.625V V is the maximum that FIFO memory can handle.A frequency of 225MHz is capable of maintaining good accuracy.During normal operation, the FIFO memory's maximum value is 225MHz .
72T72115L4-4BB Features
Frequency at most
72T72115L4-4BB Applications
There are a lot of Integrated Device Technology (IDT) 72T72115L4-4BB FIFOs Memory applications.
- Video Processing
- Temporary storage elements
- Video
- Look-up Tables
- Programmable Logic Controller
- Computers
- Data
- Event Recorder
- General Data Collection Applications at Extreme High-Temperatures
- Notebook