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72V04L15JG

3.3V 32 Pin FIFO memory IC4.5kB15 ns Min 3V VMax 3.6V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Nocochips NO: 378-72V04L15JG
  • Package: PLCC
  • Datasheet: PDF
  • Stock: 866
  • Description: 3.3V 32 Pin FIFO memory IC4.5kB15 ns Min 3V VMax 3.6V V(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Plating Tin
Mount Surface Mount
Package / Case PLCC
Number of Pins 32
Published 2009
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1
ECCN Code EAR99
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Pin Count 32
Operating Supply Voltage 3.3V
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Memory Size 4.5kB
Element Configuration Dual
Nominal Supply Current 60mA
Max Supply Current 60mA
Frequency (Max) 40MHz
Access Time 15 ns
Data Bus Width 9b
Density 36 kb
Sync/Async Asynchronous
Word Size 9b
Bus Directional Unidirectional
Retransmit Capability Yes
Length 13.97mm
Width 11.43mm
Thickness 2.79mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

72V04L15JG Overview


PLCC is the package in which FIFO memory chip is contained.In addition to storing applications and data, the FIFO chips have a memory of 4.5kB .It is pointing in the direction of Surface Mount .32 pin is used for operation.The maximum current required for its operation is 60mA .A 3.3V supply voltage will ensure FIFO's maximum efficiency.The FIFO products must be run at a minimum temperature of 0°C degrees Celsius to ensure reliability.Its maximum operating temperature of 70°C °C ensures stable operation.There is a possibility that FIFO may operate at a very low supply voltage, such as 3V V.A maximum voltage of 3.6V volts can be applied to FIFO memory.As a result, it contains a total of 32 pins.40MHz is the FIFO memory IC's maximum value for regular operation.

72V04L15JG Features


4.5kB memory size
Frequency at most

72V04L15JG Applications


There are a lot of Integrated Device Technology (IDT) 72V04L15JG FIFOs Memory applications.

  • Computer Systems
  • Product traceability
  • Portable Information Devices
  • Laser Receiver System
  • Down-Hole Energy Drilling
  • High-speed graphics pixel buffer
  • PC peripheral
  • Communications
  • Buses
  • SPD for DDR3 Memory Modules

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