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72V05L15JG

3.3V 32 Pin FIFO memory IC9kB15 ns Min 3V VMax 3.6V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Nocochips NO: 378-72V05L15JG
  • Package: PLCC
  • Datasheet: PDF
  • Stock: 258
  • Description: 3.3V 32 Pin FIFO memory IC9kB15 ns Min 3V VMax 3.6V V(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Plating Tin
Mount Surface Mount
Package / Case PLCC
Number of Pins 32
Published 2009
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Operating Supply Voltage 3.3V
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Memory Size 9kB
Element Configuration Dual
Nominal Supply Current 75mA
Max Supply Current 75mA
Frequency (Max) 40MHz
Access Time 15 ns
Data Bus Width 9b
Density 72 kb
Sync/Async Asynchronous
Word Size 9b
Bus Directional Unidirectional
Retransmit Capability Yes
FWFT Support No
Length 13.97mm
Width 11.43mm
Thickness 2.79mm
RoHS Status RoHS Compliant
Lead Free Lead Free

72V05L15JG Overview


You can find FIFO memory chip in package PLCC .There is a 9kB MB memory on the FIFO chips, which can be used to store both applications and data.Surface Mount is recommended as the mounting method.In the case of the operation pins, they are 32 pins.The maximum current required for its operation is 75mA .When the supply voltage is set to 3.3V , the FIFO's maximum efficiency is achieved.To ensure reliabilFIFOy, FIFO runs at a minimum working temperature of 0°C degrees Celsius.Keeping the operating temperature at 70°C °C allows the FIFO products to operate continuously.In some cases, FIFO operates at a very low supply voltage, such as 3V V.A maximum supply voltage of 3.6V volts can be handled by the FIFO memory chip.During regular operation, 40MHz is the FIFO memory's maximum value.

72V05L15JG Features


9kB memory size
Frequency at most

72V05L15JG Applications


There are a lot of Integrated Device Technology (IDT) 72V05L15JG FIFOs Memory applications.

  • Analog-to-digital converters
  • Character generators
  • Networking
  • IP Radio
  • Down-Hole Energy Drilling
  • Wireless
  • Code converters
  • Network bridges
  • Temporary storage elements
  • Thermal Management for DDR3 Memory Modules

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