Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Tin |
Mount |
Surface Mount |
Package / Case |
PLCC |
Number of Pins |
32 |
Published |
2009 |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 |
ECCN Code |
EAR99 |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
Frequency |
40MHz |
Pin Count |
32 |
Operating Supply Voltage |
3.3V |
Max Supply Voltage |
3.6V |
Min Supply Voltage |
3V |
Memory Size |
18kB |
Element Configuration |
Dual |
Nominal Supply Current |
75mA |
Max Supply Current |
75mA |
Frequency (Max) |
40MHz |
Access Time |
15 ns |
Data Bus Width |
9b |
Density |
144 kb |
Sync/Async |
Asynchronous |
Word Size |
9b |
Bus Directional |
Unidirectional |
Retransmit Capability |
Yes |
FWFT Support |
No |
Height |
2.79mm |
Length |
13.97mm |
Width |
11.43mm |
Thickness |
2.79mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
72V06L15JG Overview
FIFO memory chip is contained in the PLCC package.It is possible to store data and applications on the FIFO chips as they have 18kB in their memory.The recommended mounting method for this FIFO products is Surface Mount .In the case of the operation pins, they are 32 pins.There is a maximum current requirement of 75mA for its operation.When setting the supply voltage to 3.3V , you will achieve FIFO's maximum efficiency.The FIFO products must be run at a minimum temperature of 0°C degrees Celsius to ensure reliability.By operating at a temperature of 70°C °C, the FIFO products is capable of stable operation.There is a possibility that FIFO can operate at very low supply voltages, such as 3V V.FIFO memory can handle a maximum supply voltage of 3.6V volts.As a result, it contains a total of 32 pins.A frequency of 40MHz is sufficient to maintain good accuracy.For regular operation, the memory logic's maximum value is 40MHz .
72V06L15JG Features
18kB memory size
Frequency at most
72V06L15JG Applications
There are a lot of Integrated Device Technology (IDT) 72V06L15JG FIFOs Memory applications.
- Thermal Management for DDR3 Memory Modules
- Computers
- Digital buffering
- Communications
- Rate buffers
- Fabrication Site
- Buses
- Video Processing
- High-speed disk
- Laser Receiver System