72V2101L10PF8
| Parameters | |
|---|---|
| Width | 14mm |
| Thickness | 1.4mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Contains Lead |
| Factory Lead Time | 1 Week |
| Contact Plating | Lead, Tin |
| Mount | Surface Mount |
| Package / Case | TQFP |
| Number of Pins | 64 |
| Packaging | Tape & Reel |
| Published | 2008 |
| Part Status | Active |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Frequency | 100MHz |
| Operating Supply Voltage | 3.3V |
| Max Supply Voltage | 3.45V |
| Min Supply Voltage | 3.15V |
| Element Configuration | Dual |
| Nominal Supply Current | 55mA |
| Max Supply Current | 55mA |
| Frequency (Max) | 100MHz |
| Access Time | 6.5 ns |
| Density | 2.3 Mb |
| Sync/Async | Synchronous |
| Word Size | 9b |
| Bus Directional | Unidirectional |
| Retransmit Capability | Yes |
| Length | 14mm |
72V2101L10PF8 Overview
FIFO memory chip is contained in the TQFP package.In terms of packaging, it comes in Tape & Reel cases.It is recommended that memory IC be mounted in the Surface Mount direction.64 pin is used for operation.FIFO design requires a maximum current of 55mA to operate.The supply voltage should be set to 3.3V in order to achieve FIFO's maximum efficiency.The FIFO products must be run at a minimum temperature of 0°C degrees Celsius to ensure reliability.By using a memory logic's maximum operating temperature of 70°C degrees Celsius, stable operation can be achieved.It is possible to operate the FIFO memory chip at very low supply voltages, such as 3.15V volts.FIFO memory is capable of handling a maximum supply voltage of 3.45V volts.It maintains good accuracy at a 100MHz frequency.During normal operation, the FIFO memory's maximum value is 100MHz .
72V2101L10PF8 Features
Frequency at most
72V2101L10PF8 Applications
There are a lot of Integrated Device Technology (IDT) 72V2101L10PF8 FIFOs Memory applications.
- Telecommunication
- Queues for communication systems
- Analog-to-digital converters
- SPI Bus Flash Memory Device
- Look-up Tables
- Medical Monitoring Device
- Data communications
- Test Equipment
- A/D output buffers
- High-speed graphics pixel buffer
