Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Lead, Tin |
Mount |
Surface Mount |
Package / Case |
BGA |
Number of Pins |
100 |
Packaging |
Bulk |
Published |
2009 |
Part Status |
Active |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
Frequency |
166MHz |
Operating Supply Voltage |
3.3V |
Max Supply Voltage |
3.45V |
Min Supply Voltage |
3.15V |
Element Configuration |
Dual |
Nominal Supply Current |
35mA |
Max Supply Current |
35mA |
Frequency (Max) |
166MHz |
Access Time |
4 ns |
Density |
4.5 Mb |
Sync/Async |
Synchronous |
Bus Directional |
Unidirectional |
Retransmit Capability |
Yes |
Length |
11mm |
Width |
11mm |
Thickness |
1.4mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Contains Lead |
72V2113L6BC Overview
FIFO memory chip is included in the BGA package.Bulk case is used for packaging.A Surface Mount mounting method is recommended.FIFO design has 100 operation pins.Its maximum operating current is 35mA .A voltage of 3.3V should be used for FIFO's maximum efficiency.The FIFO products must be run at a minimum temperature of 0°C degrees Celsius to ensure reliability.By using a memory logic's maximum operating temperature of 70°C degrees Celsius, stable operation can be achieved.If the supply voltage is very low, such as 3.15V V, FIFO may be able to operate.The FIFO memory chip is capable of handling maximum supply voltages of 3.45V volts.With a frequency of 166MHz , it maintains good accuracy.Regular operation has a FIFO memory's maximum value of 166MHz .
72V2113L6BC Features
Frequency at most
72V2113L6BC Applications
There are a lot of Integrated Device Technology (IDT) 72V2113L6BC FIFOs Memory applications.
- Multi-stage synchronizer
- Consumer Systems
- Data
- Desktop Computers
- SPD for DDR3 Memory Modules
- Address mapping
- SPI Bus Flash Memory Devices
- TVs
- Buses
- Measurement Equipment