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72V241L15J8

3.3V 32 Pin FIFO memory IC10 ns Min 3V VMax 3.6V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Nocochips NO: 378-72V241L15J8
  • Package: PLCC
  • Datasheet: PDF
  • Stock: 797
  • Description: 3.3V 32 Pin FIFO memory IC10 ns Min 3V VMax 3.6V V(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case PLCC
Number of Pins 32
Published 2005
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 66.7MHz
Operating Supply Voltage 3.3V
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Element Configuration Dual
Nominal Supply Current 20mA
Max Supply Current 20mA
Frequency (Max) 66.7MHz
Access Time 10 ns
Density 36 kb
Sync/Async Synchronous
Word Size 9b
Bus Directional Unidirectional
FWFT Support No
Programmable Flags Support Yes
Length 13.97mm
Width 11.43mm
Thickness 2.79mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

72V241L15J8 Overview


PLCC is the package in which FIFO memory chip is contained.Surface Mount is recommended as the mounting method.Operation pins are 32 .In order for FIFO design to operate, FIFO design requires a maximum current of 20mA .FIFO is recommended that the supply voltage be set to 3.3V for maximum efficiency.For reliability, FIFO works at a minimum temperature of 0°C degrees Celsius.Keeping the operating temperature at 70°C °C allows the FIFO products to operate continuously.FIFO memory chips may be operated at very low supply voltages, such as 3V volts.FIFO memory can handle a maximum supply voltage of 3.6V V.A frequency of 66.7MHz is capable of maintaining good accuracy.The memory logic's maximum value is 66.7MHz for regular operation.

72V241L15J8 Features


Frequency at most

72V241L15J8 Applications


There are a lot of Integrated Device Technology (IDT) 72V241L15J8 FIFOs Memory applications.

  • Desktop Computers
  • Video time base correction
  • Laser Receiver System
  • Temporary storage elements
  • SPI Bus Flash Memory Devices
  • Medical Monitoring Device
  • Queues for communication systems
  • Fabrication Site
  • Optical memories
  • High-speed disk

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