Parameters |
Current - Supply (Max) |
30mA |
Memory Size |
72K 4K x 18 |
Access Time |
6.5ns |
Data Rate |
100MHz |
Bus Directional |
Uni-Directional |
Retransmit Capability |
No |
FWFT Support |
Yes |
Programmable Flags Support |
Yes |
Expansion Type |
Depth, Width |
RoHS Status |
ROHS3 Compliant |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
64-LQFP |
Supplier Device Package |
64-TQFP (10x10) |
Operating Temperature |
0°C~70°C |
Packaging |
Tray |
Series |
72V |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Voltage - Supply |
3V~3.6V |
Base Part Number |
72V245 |
Function |
Synchronous |
72V245L10TFG Overview
The 64-LQFP package contains FIFO memory chip.In this case, it is packaged in case number Tray .In addition, the FIFO chip has a memory capacity of 72K 4K x 18 , which can be used to store applications and data.It is recommended that the temperature of the system be regulated to 0°C~70°C for reliable operation.Surface Mount is the mounting type of the FIFO memory.This FIFO products operates at 3V~3.6V volts.A component in the 72V series, this is an memory logic.Memory IC's maximum operating supply current is 30mA .Memory IC is a member of the 72V245 family.
72V245L10TFG Features
72K 4K x 18 memory size
72V series
Best part number of 72V245
72V245L10TFG Applications
There are a lot of Renesas Electronics America Inc. 72V245L10TFG FIFOs Memory applications.
- A/D output buffers
- Battery Charger
- Switches
- Down-Hole Energy Drilling
- Data
- Communications Systems
- SPI Bus Flash Memory Devices
- Controlled baseline
- Extended product-change notification
- General Data Collection Applications at Extreme High-Temperatures