72V253L6BCG
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 100-LBGA |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Series | 72V |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.15V~3.45V |
| Base Part Number | 72V253 |
| Function | Synchronous |
| Current - Supply (Max) | 35mA |
| Memory Size | 72K 4K x 18 8K x 9 |
| Access Time | 4ns |
| Data Rate | 166MHz |
| Bus Directional | Uni-Directional |
| FWFT Support | Yes |
| Expansion Type | Depth, Width |
| RoHS Status | ROHS3 Compliant |
72V253L6BCG Overview
The 100-LBGA package contains FIFO memory chip.In the shape of a Tray , it's packaged.It is possible to store data and applications on the FIFO chips as they have 72K 4K x 18 8K x 9 in their memory.To ensure reliable operation, the temperature should be regulated to 0°C~70°C .It is mounted in the Surface Mount position.It uses a supply voltage of 3.15V~3.45V to operate.The 72V series includes this memory logic.As far as operating current is concerned, it has a maximum of 35mA .Memory IC belongs to the 72V253 family.
72V253L6BCG Features
72K 4K x 18 8K x 9 memory size
72V series
Best part number of 72V253
72V253L6BCG Applications
There are a lot of Renesas Electronics America Inc. 72V253L6BCG FIFOs Memory applications.
- Event Recorder
- Computers
- Cardiac Monitoring Device
- Seismic Data Collection at Extreme Temperatures
- Consumer
- Fabrication Site
- Network switching/routing
- Data-acquisition systems
- SPI Bus Flash Memory Device
- Down-Hole Energy Drilling
