72V255LA10TFG
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 64-LQFP |
| Supplier Device Package | 64-TQFP (10x10) |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Series | 72V |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3V~3.6V |
| Base Part Number | 72V255 |
| Function | Synchronous |
| Current - Supply (Max) | 55mA |
| Memory Size | 144K 8K x 18 |
| Access Time | 6.5ns |
| Data Rate | 100MHz |
| Bus Directional | Uni-Directional |
| Retransmit Capability | Yes |
| FWFT Support | Yes |
| Programmable Flags Support | Yes |
| Expansion Type | Depth, Width |
| RoHS Status | ROHS3 Compliant |
72V255LA10TFG Overview
This package is included in 64-LQFP .This FIFO memory chip is packaged as a Tray .There is a memory of 144K 8K x 18 available for storing data and applications.It is recommended that the temperature of the system be regulated to 0°C~70°C for reliable operation.There is Surface Mount mounting type for this FIFO memory.For operation, a voltage of 3V~3.6V is used.The 72V series comprises this memory logic.In this case, the FIFO's maximum supply current is 55mA .FIFO's FIFO's maximumA member of the 72V255 family, it has the following characteristics.
72V255LA10TFG Features
144K 8K x 18 memory size
72V series
Best part number of 72V255
72V255LA10TFG Applications
There are a lot of Renesas Electronics America Inc. 72V255LA10TFG FIFOs Memory applications.
- Buses
- Microprogramming
- Test Equipment
- Network switching/routing
- SPI Bus Flash Memory Device
- High-speed graphics pixel buffer
- Seismic Data Collection at Extreme Temperatures
- Video Processing
- Event Recorder
- General Data Collection Applications at Low-Temperatures
