72V263L6BCG
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 100-LBGA |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Series | 72V |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.15V~3.45V |
| Base Part Number | 72V263 |
| Function | Synchronous |
| Current - Supply (Max) | 35mA |
| Memory Size | 144K 8K x 18 16K x 9 |
| Access Time | 4ns |
| Data Rate | 166MHz |
| Bus Directional | Uni-Directional |
| FWFT Support | Yes |
| Expansion Type | Depth, Width |
| RoHS Status | ROHS3 Compliant |
72V263L6BCG Overview
100-LBGA is the package in which FIFO memory chip is contained.This FIFO memory chip is packaged as a Tray .A FIFO chip's memory is 144K 8K x 18 16K x 9 , which may be used to store applications and data.A temperature regulation of 0°C~70°C is crucial for reliable operation.It is mounted in the Surface Mount position.A supply voltage of 3.15V~3.45V is required for its operation.It is a component from the 72V series.In this case, the FIFO's maximum supply current is 35mA .FIFO's FIFO's maximumMemory IC belongs to the 72V263 family.
72V263L6BCG Features
144K 8K x 18 16K x 9 memory size
72V series
Best part number of 72V263
72V263L6BCG Applications
There are a lot of Renesas Electronics America Inc. 72V263L6BCG FIFOs Memory applications.
- General Data Collection Applications at Extreme High-Temperatures
- Thermal Management for DDR3 Memory Modules
- SPI Bus Flash Memory Device
- Smart Meter
- Data-acquisition systems
- Switches
- Extended product life cycle
- Microprogramming
- Computer Systems
- A/D output buffers
