72V36100L7-5BB8
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Lead, Tin |
| Mount | Surface Mount |
| Package / Case | BGA |
| Number of Pins | 144 |
| Packaging | Tape & Reel |
| Published | 2003 |
| Part Status | Active |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Frequency | 133.3MHz |
| Operating Supply Voltage | 3.3V |
| Max Supply Voltage | 3.45V |
| Min Supply Voltage | 3.15V |
| Element Configuration | Dual |
| Nominal Supply Current | 40mA |
| Max Supply Current | 40mA |
| Frequency (Max) | 133.3MHz |
| Access Time | 5 ns |
| Direction | Unidirectional |
| Density | 2.3 Mb |
| Sync/Async | Synchronous |
| Word Size | 36b |
| Bus Directional | Unidirectional |
| Retransmit Capability | Yes |
| FWFT Support | Yes |
| Programmable Flags Support | Yes |
| Length | 13mm |
| Width | 13mm |
| Thickness | 1.76mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Contains Lead |
72V36100L7-5BB8 Overview
This package is included in BGA .There's a Tape & Reel on the package.The recommended mounting way is Surface Mount .144 pins are the operation pins.In order to operate it, it requires 40mA volts of current.In order to maximize efficiency, the supply voltage should be set to 3.3V .It operates at 0°C degrees Celsius to ensure reliability.The stable operation is enabled by the memory logic's maximum operating temperature of 70°C °C.In some cases, FIFO operates at a very low supply voltage, such as 3.15V V.This FIFO memory chip can handle maximum supply voltages of 3.45V volts.Despite a frequency of 133.3MHz , it is capable of maintaining good accuracy.Regular operation has a FIFO memory's maximum value of 133.3MHz .
72V36100L7-5BB8 Features
Frequency at most
72V36100L7-5BB8 Applications
There are a lot of Integrated Device Technology (IDT) 72V36100L7-5BB8 FIFOs Memory applications.
- Smart Meter
- Portable Information Devices
- Communications Systems
- Seismic Data Collection at Extreme Temperatures
- Measurement Equipment
- General Data Collection Applications at Low-Temperatures
- High-speed disk
- High-speed graphics pixel buffer
- Test Equipment
- Wireless
