72V36100L7-5PFI8
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Lead, Tin |
| Mount | Surface Mount |
| Package / Case | TQFP |
| Number of Pins | 128 |
| Published | 2008 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| HTS Code | 8542.32.00.71 |
| Peak Reflow Temperature (Cel) | 225 |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 128 |
| Operating Supply Voltage | 3.3V |
| Max Supply Voltage | 3.45V |
| Min Supply Voltage | 3.15V |
| Element Configuration | Dual |
| Max Supply Current | 40mA |
| Frequency (Max) | 133.3MHz |
| Access Time | 5 ns |
| Bus Directional | Unidirectional |
| Retransmit Capability | Yes |
| Length | 20mm |
| Width | 14mm |
| Thickness | 1.4mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Contains Lead |
72V36100L7-5PFI8 Overview
TQFP is a package that contains FIFO memory chip.Memory IC's recommended mounted way is Surface Mount .These are the 128 pins for operation.In order for FIFO design to operate, FIFO design requires a maximum current of 40mA .When the supply voltage is set to 3.3V , the FIFO's maximum efficiency is achieved.The FIFO products must be run at a minimum temperature of -40°C degrees Celsius to ensure reliability.By operating at 85°C degrees Celsius, this FIFO products is able to maintain a stable operation.The FIFO memory chip may be operated at very low supply voltages, such as3.15V volts.The memory logic's maximum supply voltage is 3.45V volts.A total of 128 pins are present on the FIFO memory IC.It is recommended that the FIFO memory's maximum value be set to 133.3MHz .
72V36100L7-5PFI8 Features
Frequency at most
72V36100L7-5PFI8 Applications
There are a lot of Integrated Device Technology (IDT) 72V36100L7-5PFI8 FIFOs Memory applications.
- Medical Monitoring Device
- Video
- Analog-to-digital converters
- SPD for DDR3 Memory Modules
- Seismic Data Collection at Extreme Temperatures
- Emulators
- Network switching/routing
- Product traceability
- One assembly
- Temporary storage elements
