Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
144-BGA |
Supplier Device Package |
144-PBGA (13x13) |
Operating Temperature |
-40°C~85°C |
Packaging |
Tray |
Series |
72V |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Voltage - Supply |
3.15V~3.45V |
Base Part Number |
72V36110 |
Function |
Synchronous |
Current - Supply (Max) |
40mA |
Memory Size |
4.7M 131K x 36 |
Access Time |
5ns |
Data Rate |
133.3MHz |
Bus Directional |
Uni-Directional |
Retransmit Capability |
Yes |
FWFT Support |
Yes |
Programmable Flags Support |
Yes |
Expansion Type |
Depth, Width |
RoHS Status |
ROHS3 Compliant |
72V36110L7-5BBGI Overview
FIFO memory chip is included in the 144-BGA package.Tray case is used for packaging.A FIFO chip's memory is 4.7M 131K x 36 , which may be used to store applications and data.It is recommended that the temperature be kept at -40°C~85°C to ensure reliable operation.There is Surface Mount mounting type for this FIFO memory.For operation, it requires a supply voltage of 3.15V~3.45V .It is a member of the 72V series .In this case, the FIFO's maximum supply current is 40mA .FIFO's FIFO's maximumThis object belongs to the family 72V36110 .
72V36110L7-5BBGI Features
4.7M 131K x 36 memory size
72V series
Best part number of 72V36110
72V36110L7-5BBGI Applications
There are a lot of Renesas Electronics America Inc. 72V36110L7-5BBGI FIFOs Memory applications.
- Test site
- Communications Systems
- Data-acquisition systems
- Computers
- Consumer
- Test Equipment
- Thermal Management for DDR3 Memory Modules
- IP Radio
- PC peripheral
- Seismic Data Collection at Extreme Temperatures