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72V3622L15PF8

3.3V 120 Pin FIFO memory IC10 ns Min 3V VMax 3.6V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Nocochips NO: 378-72V3622L15PF8
  • Package: TQFP
  • Datasheet: PDF
  • Stock: 903
  • Description: 3.3V 120 Pin FIFO memory IC10 ns Min 3V VMax 3.6V V(Kg)

Details

Tags

Parameters
Direction Bidirectional
Density 18 kb
Sync/Async Synchronous
Word Size 36b
Bus Directional Bidirectional
Retransmit Capability No
FWFT Support Yes
Programmable Flags Support Yes
Length 14mm
Width 14mm
Thickness 1.4mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
Mount Surface Mount
Package / Case TQFP
Number of Pins 120
Packaging Tape & Reel
Published 2013
Part Status Discontinued
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 66.7MHz
Operating Supply Voltage 3.3V
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Element Configuration Dual
Nominal Supply Current 400mA
Max Supply Current 400mA
Frequency (Max) 66.7MHz
Access Time 10 ns
Data Bus Width 36b

72V3622L15PF8 Overview


You will find FIFO memory chip in the TQFP package.The package comes in a case of Tape & Reel .It is pointing in the direction of Surface Mount .120 pins are used for operation.For its operation, 400mA is the maximum current required.The supply voltage should be set to 3.3V in order to achieve FIFO's maximum efficiency.At a minimum working temperature of 0°C degrees Celsius, FIFO is guaranteed to operate reliably.By operating at a temperature of 70°C °C, the FIFO products is capable of stable operation.The FIFO memory chip may be operated at very low supply voltages, such as3V volts.An input voltage of 3.6V V is the maximum that FIFO memory can handle.When the frequency is set to 66.7MHz it can maintain good accuracy.A FIFO memory's maximum value of 66.7MHz can be used for regular operation.

72V3622L15PF8 Features


Frequency at most

72V3622L15PF8 Applications


There are a lot of Integrated Device Technology (IDT) 72V3622L15PF8 FIFOs Memory applications.

  • Game Controller
  • Address mapping
  • Thermal Management for DDR3 Memory Modules
  • Telecommunication
  • SPI Bus Flash Memory Devices
  • Digital buffering
  • Test site
  • Controlled baseline
  • Networking
  • Portable Information Devices

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