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72V3650L6PFG

3.3V 128 Pin FIFO memory IC4 ns Min 3.15V VMax 3.45V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Nocochips NO: 378-72V3650L6PFG
  • Package: TQFP
  • Datasheet: PDF
  • Stock: 385
  • Description: 3.3V 128 Pin FIFO memory IC4 ns Min 3.15V VMax 3.45V V(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Plating Tin
Mount Surface Mount
Package / Case TQFP
Number of Pins 128
Published 2008
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 166MHz
Operating Supply Voltage 3.3V
Max Supply Voltage 3.45V
Min Supply Voltage 3.15V
Element Configuration Dual
Nominal Supply Current 40mA
Max Supply Current 40mA
Frequency (Max) 166MHz
Access Time 4 ns
Direction Unidirectional
Density 72 kb
Sync/Async Synchronous
Word Size 36b
Bus Directional Unidirectional
Retransmit Capability Yes
FWFT Support Yes
Programmable Flags Support Yes
Length 20mm
Width 14mm
Thickness 1.4mm
RoHS Status RoHS Compliant
Lead Free Lead Free

72V3650L6PFG Overview


You can find FIFO memory chip in the TQFP package.It is pointing in the direction of Surface Mount .These are the 128 pins for operation.FIFO design requires a maximum current of 40mA to operate.FIFO is recommended that the supply voltage be set to 3.3V in order to maximize efficiency.At a minimum working temperature of 0°C degrees Celsius, FIFO is guaranteed to operate reliably.The stable operation is enabled by the memory logic's maximum operating temperature of 70°C °C.There is a possibility that FIFO may operate at a very low supply voltage, such as 3.15V V.FIFO memory can handle a maximum supply voltage of 3.45V V.A frequency of 166MHz is capable of maintaining good accuracy.The memory logic's maximum value is 166MHz for regular operation.

72V3650L6PFG Features


Frequency at most

72V3650L6PFG Applications


There are a lot of Integrated Device Technology (IDT) 72V3650L6PFG FIFOs Memory applications.

  • Notebook
  • IP Camera Buffer
  • A/D output buffers
  • Wireless
  • Analog-to-digital converters
  • Fabrication Site
  • High-speed graphics pixel buffer
  • Temporary storage elements
  • General Data Collection Applications at Low-Temperatures
  • Battery Charger

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