Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Lead, Tin |
Mount |
Surface Mount |
Package / Case |
BGA |
Number of Pins |
144 |
Packaging |
Bulk |
Published |
2003 |
Part Status |
Active |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
Frequency |
166MHz |
Operating Supply Voltage |
3.3V |
Max Supply Voltage |
3.45V |
Min Supply Voltage |
3.15V |
Element Configuration |
Dual |
Nominal Supply Current |
40mA |
Max Supply Current |
40mA |
Frequency (Max) |
166MHz |
Access Time |
4 ns |
Density |
144 kb |
Sync/Async |
Synchronous |
Word Size |
36b |
Bus Directional |
Unidirectional |
Retransmit Capability |
Yes |
Length |
13mm |
Width |
13mm |
Thickness |
1.76mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Contains Lead |
72V3660L6BB Overview
The BGA package contains FIFO memory chip.In terms of packaging, it comes in Bulk cases.Surface Mount is recommended as the mounting method.There are 144 pins for operation.The maximum current required for its operation is 40mA .FIFO is recommended that the supply voltage be set to 3.3V for maximum efficiency.It is designed to run at a minimum temperature of 0°C degrees Celsius to ensure reliability.Keeping the operating temperature at 70°C °C allows the FIFO products to operate continuously.The FIFO memory chip may be operated at very low supply voltages, such as3.15V volts.FIFO memory is capable of handling a maximum supply voltage of 3.45V volts.It is capable of maintaining good accuracy with a frequency of 166MHz .Normally, the FIFO memory's maximum value is 166MHz .
72V3660L6BB Features
Frequency at most
72V3660L6BB Applications
There are a lot of Integrated Device Technology (IDT) 72V3660L6BB FIFOs Memory applications.
- Portable Information Devices
- High-speed graphics pixel buffer
- Optical memories
- Code converters
- Switches
- Temporary storage elements
- Communications Systems
- Network bridges
- Wireless
- Transistors