Parameters |
Factory Lead Time |
1 Week |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
20-TSSOP (0.173, 4.40mm Width) |
Supplier Device Package |
20-TSSOP |
Operating Temperature |
-40°C~85°C |
Packaging |
Tube |
Published |
2010 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Max Operating Temperature |
85°C |
Min Operating Temperature |
-40°C |
Voltage - Supply |
3V~3.6V |
Base Part Number |
73M1906 |
Function |
Direct Access Arrangement (DAA) |
Interface |
PCM |
Number of Circuits |
1 |
Max Supply Voltage |
3.6V |
Min Supply Voltage |
3V |
Data Rate |
1.536 Mbps |
RoHS Status |
ROHS3 Compliant |
73M1906B-IVT/F Overview
Saving board space is achieved with the 20-TSSOP (0.173, 4.40mm Width) package.Telecommunications equipment is packed according to Tube's method.A Surface Mount mounting type is used.The telecom IC is composed of 1 circuits.Improved efficiency can be ensured when the supply voltage of 3V~3.6V is provided.Using -40°C~85°C as the operating temperature can result in reliable performance.Mounted in the direction of Surface Mount.73M1906 is the base part number, which can be used to find more related parts.Ensure normal operation by setting the temperature to -40°C minimum.The temperature is set at the maximum value of 85°C to ensure normal operation.A voltage of at least 3V should be supplied.If the voltage supplied is lower than 3.6V, telecommunications device should be used.
73M1906B-IVT/F Features
Available in the 20-TSSOP (0.173, 4.40mm Width) package
73M1906B-IVT/F Applications
There are a lot of Maxim Integrated 73M1906B-IVT/F Telecom applications.
- Inverse Multiplexing for ATM (IMA) Wireless Base Stations
- High-Density T1/E1/J1 interfaces for Multiplexers
- Channel Banks
- PBXs channel bank
- Dual battery supply voltage SLICs
- Add/Drop multiplexers (ADMs)
- BITS Timing
- Interfaces to E3
- Fractional T1/E1/J1
- E3/DS3 Access Equipment