73M1916-IM/F
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 32-VFQFN Exposed Pad |
| Supplier Device Package | 32-QFN-EP (5x5) |
| Operating Temperature | -40°C~85°C |
| Packaging | Tube |
| Series | MicroDAA™ |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3V~3.6V |
| Function | Data Access Arrangement (DAA) |
| Interface | PCM, SPI |
| Number of Circuits | 1 |
| RoHS Status | Non-RoHS Compliant |
73M1916-IM/F Overview
The 32-VFQFN Exposed Pad package reduces the amount of space on a board.For packing, Tube is used.Mounting type Surface Mount is used.1 circuits are used in this telecom IC .Telecom circuit is possible to increase efficiency by providing 3V~3.6V with a higher voltage.Telecom switching is possible to achieve reliable performance when the operating temperature is set at -40°C~85°C.With the MicroDAA? series electronic parts, it can provide a lot of similar features.
73M1916-IM/F Features
Available in the 32-VFQFN Exposed Pad package
73M1916-IM/F Applications
There are a lot of Rochester Electronics, LLC 73M1916-IM/F Telecom applications.
- T1/E1/J1 LAN/WAN Routers
- Digital access cross connects
- Multi-Line E1 Interface Cards
- ISDN terminal adapter
- DECT (Digital European Cordless Telephone) Base Stations
- Inverse Multiplexing for ATM (IMA)
- Interfaces to DS3
- T1/E1/J1 add/drop multiplexers (MUX)
- Home Gateway
- Digital subscriber line access multiplexer (DSLAM)
