Parameters |
Mounting Type |
Surface Mount |
Package / Case |
48-TFSOP (0.240, 6.10mm Width) |
Surface Mount |
YES |
Operating Temperature |
-40°C~85°C TA |
Packaging |
Tube |
Series |
74ACTQ |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
2 (1 Year) |
Number of Terminations |
48 |
Terminal Finish |
MATTE TIN |
Technology |
CMOS |
Voltage - Supply |
4.5V~5.5V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Number of Functions |
4 |
Supply Voltage |
5V |
Terminal Pitch |
0.5mm |
Reach Compliance Code |
unknown |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Pin Count |
48 |
Qualification Status |
Not Qualified |
Output Type |
3-State |
Number of Elements |
4 |
Supply Voltage-Max (Vsup) |
5.5V |
Number of Ports |
2 |
Number of Bits |
4 |
Family |
ACT |
Current - Output High, Low |
24mA 24mA |
Logic Type |
Buffer, Non-Inverting |
Output Polarity |
TRUE |
Propagation Delay (tpd) |
13.1 ns |
Height Seated (Max) |
1.2mm |
Length |
12.5mm |
Width |
6.1mm |
RoHS Status |
ROHS3 Compliant |
74ACTQ16244MTD Overview
Logical driver uses a neat 48-TFSOP (0.240, 6.10mm Width) package. Tube external packaging. Available in Surface Mount. Voltage buffer adopts Buffer, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 4.5V~5.5V. Qualified to operate within -40°C~85°C TA. The high and low logic state output current of logical driver is 24mA 24mA. Logical driver can deal with 3-State output (s). All of the 4 elements are put into use. Digital buffer is one of the 74ACTQ series devices. 48 terminations with different functions. Buffer IC reuqires a supply voltage of 5V. This electronic component belongs to the ACT family. 48 pins are set with the electric part. Enhanced with 2 ports. 4 bits are included within the electrical component.
74ACTQ16244MTD Features
74ACTQ16244MTD Applications
There are a lot of Rochester Electronics, LLC 74ACTQ16244MTD Buffers & Transceivers applications.
- Car radio
- Interconnection between switches and computers
- Data center
- Optical sub-assembly (OSA)
- Cell phones
- Metro access rings
- Wireless access points
- TV signal transmission
- Indoor ad hoc meeting
- Precision engineering measurement