Parameters |
Mounting Type |
Surface Mount |
Package / Case |
56-TFSOP (0.240, 6.10mm Width) |
Surface Mount |
YES |
Operating Temperature |
-40°C~85°C TA |
Packaging |
Tape & Reel (TR) |
Series |
74ALVC |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
2 (1 Year) |
Number of Terminations |
56 |
Terminal Finish |
MATTE TIN |
Technology |
CMOS |
Voltage - Supply |
1.65V~3.6V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Number of Functions |
1 |
Supply Voltage |
1.8V |
Terminal Pitch |
0.5mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Pin Count |
56 |
JESD-30 Code |
R-PDSO-G56 |
Qualification Status |
COMMERCIAL |
Output Type |
3-State |
Number of Elements |
1 |
Supply Voltage-Max (Vsup) |
3.6V |
Number of Ports |
2 |
Family |
ALVC/VCX/A |
Current - Output High, Low |
12mA 12mA |
Logic Type |
Buffer, Non-Inverting |
Output Polarity |
TRUE |
Number of Bits per Element |
20 |
Propagation Delay (tpd) |
9.8 ns |
RoHS Status |
ROHS3 Compliant |
74ALVC162839TX Overview
Logical driver uses a neat 56-TFSOP (0.240, 6.10mm Width) package. Tape & Reel (TR) external packaging. Available in Surface Mount. Voltage buffer adopts Buffer, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 1.65V~3.6V. Qualified to operate within -40°C~85°C TA. The high and low logic state output current of logical driver is 12mA 12mA. Logical driver can deal with 3-State output (s). All of the 1 elements are put into use. Digital buffer is one of the 74ALVC series devices. 56 terminations with different functions. Buffer IC reuqires a supply voltage of 1.8V. This electronic component belongs to the ALVC/VCX/A family. 56 pins are set with the electric part. Enhanced with 2 ports. The bus transceiver employs 20 bits for each element.
74ALVC162839TX Features
74ALVC162839TX Applications
There are a lot of Rochester Electronics, LLC 74ALVC162839TX Buffers & Transceivers applications.
- Vehicle, ship, aircraft navigation and positioning
- Wireless smart house
- Notebook
- Fiber distributed data interface (FDDI)
- interconnection between computers
- IP cameras
- Precision geodetic measurement
- Sensor reporting
- Interconnection between switches and computers
- Optical sub-assembly (OSA)